RESIN PASTE FOR DIE BONDING, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

A resin paste for die bonding, which comprises a polyurethane imide resin represented by general formula (I), a thermosetting resin, a filler, and a solvent for printing, wherein the amount of the thermosetting resin added is 250 to 500 parts by mass relative to 100 parts by mass of the polyurethane imide resin. [In the formula, R1 represents a bivalent organic group containing an aromatic ring or an aliphatic ring; R2 represents a bivalent organic group having a molecular weight of 100 to 10,000; R3 represents a tetravalent organic group containing at least 4 carbon atoms; and n and m independently represent an integer of 1 to 100.]