| 摘要 |
PURPOSE: A thermosetting epoxy resin, and a semiconductor device including thereof are provided to improve the mobility, the reflow tolerance, the reliability when storing the resin at high temperature, and the heterogeneity. CONSTITUTION: A thermosetting epoxy resin contains the following: a reaction mixture of a triazine derivative epoxy resin with the equivalent ratio of an epoxy group and acid anhydride is 0.6~2.0, and the acid anhydride; an internal release agent; a reflective material; an inorganic filler; and a curing catalyst. The internal release agent contains carboxylate ester marked with chemical formula 1, and a compound marked with chemical formula 2. In the chemical formula 1, R11 and R12 are CnH2n+1, and n is an integer selected from 1~30. In the chemical formula 2, R1,R2, and R3 are H, -OH, -OR or -OCOCaHb. A is 10~30 and b is 17~61. |
