| 摘要 |
PURPOSE: An epoxy resin composition is provided to improve adhesive force with a pre-plated frame and a silver-plated pad, to enhance the reliability of the semiconductor device, and to obtain excellent flame retardant property without using a flame retardant. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device includes an epoxy resin, a hardener, a curing accelerator, filler, and an adhesive strength improver. The adhesive strength improver is a bisphenol type episulfide resin which is marked as a chemical formula 1 and a thiuram-based compound which is marked as a chemical formula 2. In the chemical formula 1, R1-R6 are hydrogen atom or an alkyl group with a carbon number of 1-4. |
