发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent manufacturing of defective substrates caused by connection of a housing tape for housing an electronic component of wrong type when performing splicing. <P>SOLUTION: If it is determined that a component ID corresponding to the feeder information of a component supply unit related to splicing having been read with a bar code scanner does not agree with the component ID which is the component information attached to a supply reel on which a new housing tape is wound and stored, it is further determined whether a device is under operation or not by CPU when "splicing registration abnormal stop function" is set to be effective. When it is determined that the device is under operation, operation for mounting an electronic component is controlled to be stopped on an electronic component mounting device. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010141215(A) 申请公布日期 2010.06.24
申请号 JP20080317738 申请日期 2008.12.12
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 HAYASHI KATSUNORI;KAWABATA YOSHIHIRO;MORIYA TOMOJI
分类号 H05K13/02 主分类号 H05K13/02
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