发明名称 METHOD AND APPARATUS FOR FORMING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a pattern which use a plastic mold and a visible radiation curable resin composition. SOLUTION: In the pattern forming method etc., the plastic mold having a prescribed pattern is pushed to the visible radiation curable resin composition to mold the prescribed pattern, and the resin composition is cured by being irradiated with light. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010137358(A) 申请公布日期 2010.06.24
申请号 JP20070105106 申请日期 2007.04.12
申请人 KYOWA HAKKO CHEMICAL CO LTD 发明人 MORIYAMA SATOSHI;HOTTA IWAO;KOMAI MASATSUGU
分类号 B29C59/02;B29C59/04;B29K79/00;H01L21/027 主分类号 B29C59/02
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