发明名称 |
METHOD AND APPARATUS FOR FORMING PATTERN |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a pattern which use a plastic mold and a visible radiation curable resin composition. SOLUTION: In the pattern forming method etc., the plastic mold having a prescribed pattern is pushed to the visible radiation curable resin composition to mold the prescribed pattern, and the resin composition is cured by being irradiated with light. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010137358(A) |
申请公布日期 |
2010.06.24 |
申请号 |
JP20070105106 |
申请日期 |
2007.04.12 |
申请人 |
KYOWA HAKKO CHEMICAL CO LTD |
发明人 |
MORIYAMA SATOSHI;HOTTA IWAO;KOMAI MASATSUGU |
分类号 |
B29C59/02;B29C59/04;B29K79/00;H01L21/027 |
主分类号 |
B29C59/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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