发明名称 LIGHT EMITTING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a light emitting element for easily forming a hermetic seal without need for a hermetic sealing constitution or strict control while achieving a longer life and stable operation of the light emitting element by reducing contaminants adhered and accumulated on a chip. SOLUTION: A photoabsorption film 5 absorbing a part of light emitted is formed on the outermost surface of an end surface on the light emitting side of a chip of a light emitting element such as a laser chip 1. By forming the photoabsorption film 5, the adhesion and accumulation of contaminants formed by reacting with light emitted are suppressed. The photoabsorption film 5 is formed of a mixture of a metal and a dielectric or a mixture of two or more kinds of dielectrics. Thus, the amount of photoabsorption of the photoabsorption film 5 is easily and strictly controlled. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010141125(A) 申请公布日期 2010.06.24
申请号 JP20080315924 申请日期 2008.12.11
申请人 SHARP CORP 发明人 OBAYASHI TAKESHI;MITSUMOTO TAKAHIRO;KAMIKAWA TAKESHI;KAWAGUCHI YOSHINOBU
分类号 H01S5/10 主分类号 H01S5/10
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