发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which can predict the suitable maintenance timing of a gate valve and its cause, and thereby, can perform the efficient operation of the apparatus. Ž<P>SOLUTION: The substrate treatment apparatus is provided with: treatment chambers PM1 and PM2 which perform treatment for a substrate; vacuum lock chambers VL1 and VL2 with vacuum robot handlers TH1 and TH2 which transfer the substrate to the treatment chamber; and an air loader LP which is connected to the chambers, and in which the substrate to be treated which is stored by load ports LP1 and LP2 is made to stand by, wherein, while controlling a vacuum robot handler by a high level controller and transferring the substrate between the chamber and the treatment chamber, gate valves PGV1 and PGV2 which partition by a programmable controller the chamber and the treatment chamber are managed, historical data of the action are created, the high level controller displays the historical data of the action on an operating panel of an operating section. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010140982(A) 申请公布日期 2010.06.24
申请号 JP20080313914 申请日期 2008.12.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KAWAHATA MAKOTO
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
主权项
地址