发明名称 DRYING APPARATUS FOR SILICON
摘要 PROBLEM TO BE SOLVED: To provide a drying apparatus for silicon which does not cause contamination on a water-wetted material and is capable of efficiently drying the silicon material. SOLUTION: The drying apparatus for silicon includes: a chamber 12 wherein the water-wetted silicon material to be dried is stored so that it can be hermetically sealed; a heating means 16 which heats clean air supplied into the chamber 12 as a heat medium; an on-off valve 18 which opens and closes a flow passage into the chamber 12 of the clean air; a pressure reduction piping system 20 to the downstream side of which a pressure reduction pump 46 is attached via a pressure reduction on-off valve 44; an exhaust piping system 22 whose upstream end communicates with the inside of the chamber 12 and to the downstream of which an exhaust fan 54 is attached via an exhaust on-off valve 52. The heating means 16 includes a heat exchange element 16c which includes a lump of high-purity silicon and is stored in a casing 16a. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010141260(A) 申请公布日期 2010.06.24
申请号 JP20080318672 申请日期 2008.12.15
申请人 TEOSS CORP 发明人 MURAI TAKESHI;KONAKA TOSHINORI
分类号 H01L21/304;F26B3/06;F26B5/04;F26B9/00;H01L21/02 主分类号 H01L21/304
代理机构 代理人
主权项
地址