| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus heat dissipation unit which has a low thermal resistance between a heat pipe and a heat transfer block and has a sufficient mechanical strength by increasing the amount of a binder staying in connections between the heat pipe and the heat transfer block. Ž<P>SOLUTION: The electronic apparatus heat dissipation unit includes: one or more heat pipes having one ends formed into a prescribed shape; and the heat transfer block which has a heating component thermally connected to one surface thereof and includes a columnar or cylindrical portion to which one ends of heat pipes are thermally connected, on the other surface and includes protrusions which are provided projectingly to the other surface and support one ends of the heat pipes. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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