发明名称 INTERCONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a three-dimensional interconnection structure reducing damage probability at the corner susceptible to interconnection damage in handling to hardly damage the interconnection at the corner. Ž<P>SOLUTION: According to one aspect of the three-dimensional interconnection structure disclosed, the interconnection structure including a base material made of a resin, a plurality of surface layer interconnections arranged on a surface of the base material, and an inner interconnection arranged within the base material, is characterized in that two surface layer interconnections which are arranged adjacent to each other, separated from the corners of the base material and connected with each other via the inner interconnection. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010141049(A) 申请公布日期 2010.06.24
申请号 JP20080314820 申请日期 2008.12.10
申请人 RICOH CO LTD 发明人 OKURA HIDEAKI;SANO TAKESHI;KOBAYASHI HIROSHI
分类号 H05K3/00;H05K1/02;H05K1/18 主分类号 H05K3/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利