| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storing an electronic component which can effectively emit the heat generated by an electronic component to the outside or to the atmosphere and can firmly join the electronic component to a heat dissipation member, and to provide an electronic apparatus using the same. SOLUTION: The package 8 for storing an electronic component comprises a flat heat dissipation member 1 having on the top face a mounting portion 10 to mount the electronic component 11, and a frame 5 which is so installed as to surround the mounting portion 10 on the top face of the heat dissipation member 1 and contains a plurality of wiring conductors 6. The heat dissipation member 1 consists of a rectangular parallelepiped metal member 2, a metal frame 3 which is formed of copper or a copper alloy mainly composed copper and is formed around the metal member 2, and copper layers 4 which cover the top and bottom faces of the metal member 2 and metal frame 3. The heat generated by the electronic component can be effectively dissipated by the metal frame 3 and the copper layers 4. COPYRIGHT: (C)2006,JPO&NCIPI |
