| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin material which hardly decomposes, when it is subjected to chemicals such as an etching solution even if it is semi-cured, serves an insulation layer, is equipped with the wiring that is embedded in a resin sheet at molding and smooth after molding, and provided with a top surface that can be smoothed, and is suitable for fine wiring. SOLUTION: A wiring circuit-attached resin material is equipped with a wiring circuit layer formed on an insulating resin layer in a B-Stage state, and the wiring circuit-attached resin material and an inner plate are laminated, thermocompressed and molded into a printed wiring board in a manufacturing method. |
