| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having a low dielectric constant, excellent in heat resistance, and further excellent in close adhesion with a substrate having an electroconductive member such as copper foil and a copper circuit, and capable of obtaining a highly close-bonding property without relying on an anchoring effect by a coarsening treatment, also a circuit substrate by using the same and an efficient method for producing the same. SOLUTION: This resin composition is characterized by at least containing at least 1 kind of a triazine compound expressed by general formula (1) or (2) and a monomer having a functional group capable of reacting with a functional group Y in the triazine compound (except for an epoxy compound and polyfunctional phenols), and the circuit substrate by using the resin composition and the method for producing the same are provided. As the form that the monomer having the functional group capable of reacting with the functional group Y, etc., a bismaleimide compound is preferable. Provided that the functional group X and functional group Y in the general formula (1) and (2), are not the same each other. COPYRIGHT: (C)2006,JPO&NCIPI |
