发明名称
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing device of a multilayer printed wiring board with high productivity without through defects. SOLUTION: The manufacturing device of the printed wiring board comprises: a pair of rolls which are provided with practically parallel rotary shafts and a gap for making a laminated body pass through there between and are supplied with a release sheet in the gap; a supply roll for supplying the release sheet; a winding roll for winding the release sheet which has passed through the gap between the rolls; and a guide member for fixedly guiding the release sheet which has passed through the gap and supplying required tension to the release sheet which has passed through the gap when peeling off the release sheet which has passed through the gap from the laminated body. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP4485588(B2) 申请公布日期 2010.06.23
申请号 JP20080223253 申请日期 2008.09.01
申请人 发明人
分类号 H05K3/40;H05K3/00;H05K3/46 主分类号 H05K3/40
代理机构 代理人
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