| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounting luminescent device which aims at the prevention of a short circuit accident and the improvement in the mounting reliability by preventing the adhesive bond from wraparound to a light emitting device, to provide a leadframe used for the luminescent device, and to provide the manufacturing method of the leadframe. <P>SOLUTION: The light luminescent device 1 is provided with a light emitting device 11; a first leadframe 13 for electrically connecting to the first electrode of the light emitting device 11; a second leadframe 14 for electrically connecting to the second electrode of the light emitting device 11; and an insulating body 16 for sealing the light emitting device 11, the connection part of the first electrode of the light emitting device 11 and the first leadframe 13, and the connection part of the second electrode of the light emitting device 11 and the second leadframe 14. It is a surface-mounting luminescent device wherein the connecting terminal for connecting to external devices of the first leadframe 13 and the second leadframe 14 is exposed to the outside of the insulating body 16 and made into a package. In the first leadframe 13 having one or a plurality of mounting section 13A with a flat top face formed in the convex shape of the same height, the light emitting device 11 is pasted up on the upper face 13a of the mounting part 13A. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
