INTEGRATED CIRCUIT STACK AND ITS THERMAL MANAGEMENT
摘要
<p>The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).</p>
申请公布号
EP2198456(A2)
申请公布日期
2010.06.23
申请号
EP20080807692
申请日期
2008.09.17
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BRUNSCHWILER, THOMAS J.;LINDERMAN, RYAN JOSEPH;MICHEL, BRUNO;ROTHUIZEN, HUGO E.