发明名称 |
Wet clean compositions for CoWP and porous dielectrics |
摘要 |
<p>The present invention is a formulation for wet clean removal of post etch and ash residue from a semiconductor substrate having a CoWP feature, consisting of;
deionized water;
organic acid;
amine and/or quaternary ammonium hydroxide, and either: (a) the molar ratio of amine and/or quaternary ammonium hydroxide to organic acid provides a pH in the range of 7-14; and/or (b) the formulation includes a corrosion inhibitor and/or oxygen scavenger. A method of using the formulation is also described.</p> |
申请公布号 |
EP2199379(A1) |
申请公布日期 |
2010.06.23 |
申请号 |
EP20090179603 |
申请日期 |
2009.12.17 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
WU, AIPING;RAO, MADHUKAR BHASKARA;BARYSCHPOLEC, EUGENE C. |
分类号 |
C11D7/26;C11D3/00;C11D3/20;C11D3/30;C11D3/43;C11D7/32;C11D7/50;C11D11/00;G03F7/42;H01L21/02 |
主分类号 |
C11D7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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