| 摘要 |
A structure of heat dissipation substrate for power LED and a device manufactured by it. The present invention overcomes the deficiencies of the complex structure, the difficulty of manufacturing process, the low productivity, the high cost and the unreliability of quality of the power LED product. The structure includes: the circuit board of integral construction which has counter bore and metal line, the counter bore has the structure of connected combination of two holes with different size. The small hole is a through hole and the large hole is a blind hole, the axis directions of the two holes are the same. The structure of the heat sink is an integral construction of trapezoidal column shape that is composed of an upper step and a lower step. The heat sink and the counter bore are correspondingly matched, and they are firmly fit with each other. A plurality of counter bores are setting on the circuit board, and the circuit board also includes a plurality of lines for positioning and cutting, and grooves and/or holes. An LED device manufactured by the structure of heat dissipating substrate, includes: heat sink, circuit board with the counter bore, LED IC, lead and encapsulation glue. The encapsulation glue covers the surface of the circuit board that has the IC and the lead, and retains the outer electrode, the encapsulation glue is both as an encapsulation layer for the IC and the lead, and as an integrated optical lens for the device. |
