发明名称 |
BONDING WIRE FOR SEMICONDUCTOR DEVICES |
摘要 |
It is an object of the present invention to provide a highly-functional bonding wire which has good wire-surface nature, loop linearity, stability of loop heights, and stability of a wire bonding shape, and which can cope with semiconductor packaging technologies, such as thinning, achievement of a fine pitch, achievement of a long span, and three-dimensional packaging. A semiconductor-device bonding wire comprises a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. The percentage of<100> orientations in crystalline orientations in the lengthwise direction in the surface of the skin layer is greater than or equal to 50%. |
申请公布号 |
EP2200076(A1) |
申请公布日期 |
2010.06.23 |
申请号 |
EP20080858289 |
申请日期 |
2008.12.02 |
申请人 |
NIPPON STEEL MATERIALS CO., LTD.;NIPPON MICROMETAL CORPORATION |
发明人 |
UNO, TOMOHIRO;KIMURA, KEIICHI;YAMADA, TAKASHI |
分类号 |
H01L23/49;C22C5/02;C22C5/04;C22C5/06;C22C9/00;H01L21/48 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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