| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of satisfactorily polishing a material to be polished under a plurality of polishing conditions. SOLUTION: Polishing stations 2a and 2b (only the station 2b is shown) for polishing a wafer W (material to be polished), and cleaning stations 3a and 3b for cleaning the wafer W are arranged alternately in a substantially circular configuration around an arm rotating shaft 4a (rotary shaft) of an arm 4 for transferring the wafer W from each polishing station to each cleaning station. Each of the station 3a and 3b includes a holding seat 18 that places the wafer W thereon and is movable toward a holding head 5 of the arm 4, and a cleaning unit 19 for cleaning the wafer W and the lower portion of the head 5. The unit 19 includes a cleaning roller 21 (cleaning member), and a cleaning member drive unit 22 that causes the roller 21 to advance between the head 5 and the seat 18. |
