FABRICATING METHOD FOR SOLDER BALL HAVING ADHESION COATING LAYER AND THE SAME

摘要

PURPOSE: A solder ball for forming an adhesive layer and a manufacturing method are provided to improve an adhesion between a circuit substrate and a solder ball by additionally forming an epoxy resin layer on the solder ball surface. CONSTITUTION: A flux(120) is coated on the surface of a solder member(110). An adhesive layer(130) is formed on the flux surface. The adhesive layer includes an epoxy resin. The flux uses a rosin-base or an organic flux. The rosin-base improves a wetting of the solder member using a liquid or a paste phase.