发明名称 |
Epoxy resin composition and semiconductor device |
摘要 |
The present invention is to provide an epoxy resin composition for encapsulating a semiconductor having a high flame resistance without using a flame retarder and having an excellent solder reflow resistance, and a semiconductor device using the same for encapsulating a semiconductor element. An epoxy resin composition for encapsulating a semiconductor of each of the first, second and third aspects essentially comprises (A) a phenol aralkyl type epoxy resin having a phenylene structure, (B) a phenol aralkyl type phenolic resin having a biphenylene structure and (D) an inorganic filler as common components, wherein (D) the inorganic filler is contained at the rate of 84 wt % or more and 92 wt % or less of the total amount of the epoxy resin composition.
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申请公布号 |
US7741388(B2) |
申请公布日期 |
2010.06.22 |
申请号 |
US20050263822 |
申请日期 |
2005.11.01 |
申请人 |
SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
MUROTANI KAZUYOSHI;UKAWA KEN |
分类号 |
C08G59/50;C08L63/00;H01L23/29 |
主分类号 |
C08G59/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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