| 摘要 |
PURPOSE: An epoxy resin composition is provided to effectively reduce the coefficient of thermal expansion of the epoxy resin composition without increasing charged capacity and to minimize warpage in a ball grid array type multichip package. CONSTITUTION: An epoxy resin composition for encapsulating a multichip package includes an epoxy resin, a hardener, a curing accelerator, a coupling agent, and inorganic filler. The epoxy resin composition includes eucryptite ceramic filler which is marked as a chemical formula 1. The chemical formula 1 is xLi_2O_(-y)Al_2O_(3-z)SiO_2. In the chemical formula 1, x, y, and z are a mixed molar ratio.
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