| 摘要 |
<p>PURPOSE: A high-temperature adhesive tape for a semiconductor package is provided to increase the density and heat resistance of a film, to control the generation of foaming void, and to improve the reliability of the semiconductor package. CONSTITUTION: A high-temperature adhesive tape for a semiconductor package includes a one or more adhesive layers between a base film and a protective film. The adhesive layer is a high thermal resistant adhesive layer including polyisoimide. The polyisoimide is a precursor which is synthesized through a ring opening polymerization of an amine-containing diamine and dianhydride. The base film(1), the high thermal resistant adhesive layer(3), an insulating adhesive layer(4), and the protective film(5) are laminated on the adhesive tape(10).</p> |
