发明名称 |
Biomolecule chip and fabrication method thereof |
摘要 |
Disclosed is a biomolecule chip and a fabrication method thereof. The biomolecule chip of the invention includes: a substrate; an insulating layer formed on the substrate; an adhesive layer formed on the insulating layer; a seed layer formed on the adhesive layer; an opening patterned at a predetermined location within the adhesive layer, the seed layer and the electroplating layer; and a biomolecule immobilized layer formed on the electroplating layer, the electroplating layer comprising a plasma-treated electroplating layer prior to the formation of the biomolecule immobilized layer. Accordingly, the immobilization of biomolecules onto the surface can be done more effectively by modifying the surface of the substrate in favor of biomolecules.
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申请公布号 |
US7741105(B2) |
申请公布日期 |
2010.06.22 |
申请号 |
US20060329240 |
申请日期 |
2006.01.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM YOUNG-IL;LEE MOON-CHUL;KANG JUNG-HO;PARK TAE-SIK |
分类号 |
B81B7/04 |
主分类号 |
B81B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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