发明名称 |
METHOD OF DEPOSITING A THICK DIELECTRIC FILM |
摘要 |
Thick dielectric films are deposited on a substrate by building up a plurality of layers by PECVD (Plasma Enhanced Chemical Vapor Deposition) in a reactor, each layer having a thickness less than the final thickness of the film to be deposited. The reactor is cleaned between the deposition of each layer. In this way, it is possible to form high quality, optical films.
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申请公布号 |
CA2369833(C) |
申请公布日期 |
2010.06.22 |
申请号 |
CA20022369833 |
申请日期 |
2002.02.01 |
申请人 |
ZARLINK SEMICONDUCTOR INC. |
发明人 |
BLAIN, STEPHANE;HARRISON, SYLVIE |
分类号 |
H01L21/02;H01L21/205;C23C16/44;G02B1/12;H01L21/365 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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