Printed circuit board for semi-conductor package and method of manufacturing the same,申请号KR20080056837-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Printed circuit board for semi-conductor package and method of manufacturing the same
摘要
申请公布号	KR100965336(B1)	申请公布日期	2010.06.22
申请号	KR20080056837	申请日期	2008.06.17
申请人		发明人
分类号	H05K1/02;H01L23/12;H01L23/14	主分类号	H05K1/02
代理机构		代理人
主权项
地址

您可能感兴趣的专利

PEN TYPE ULTRASONIC COLORFUL IMAGER

SENSORS FOR SOFT ROBOTS AND SOFT ACTUATORS

METHOD OF DECORATING A SUBSTRATE SURFACE AND ARTICLES THEREBY

WATER SOLVATED GLASS/AMORPHOUS SOLID IONIC CONDUCTORS

CORROSION-RESISTANT ALUMINUM ALLOY FOR HEAT EXCHANGER

SPLIT PATH DATA COMMUNICATION

IMPROVED MEASUREMENT OF DOWNHOLE GAMMA RADIATION BY REDUCTION OF COMPTON SCATTERING

ANTENNA BATTERY ASSEMBLY

COMBUSTION DUCT ASSEMBLY FOR GAS TURBINE

RAPID AND SENSITIVE METHOD OF FORENSIC TOXICOLOGY IN POST-MORTEM SUBJECTS USING ORAL FLUID TESTING

A METHOD OF FORMING A BUILDING PANEL OR SURFACE ELEMENT AND SUCH A BUILDING PANEL AND SURFACE ELEMENT

MULTIMEDIA FILE PLAYING METHOD AND APPARATUS

METHOD FOR IMPROVING HEALTH OUTCOMES

DEVICE FOR MEASURING THE ELECTRIC POWER DRAWN BY A RAILWAY VEHICLE FROM A HIGH-VOLTAGE ELECTRIC SUPPLY LINE

POLYPEPTIDES FOR THE DIAGNOSIS AND THE TREATMENT OF C3 NEF ASSOCIATED C3 GLOMERULOPATHY

LOW THERMAL DESIGN FOR DC-DC CONVERTER

METHOD AND APPARATUS FOR TRANSMITTING AND RECEIVING CONTROL INFORMATION

WIRELESS CONTROL SYSTEM FOR VEHICLE HANDLE

METHOD AND CLIENT TERMINAL FOR PROMPTING INSTANT COMMUNICATION MESSAGE