发明名称 |
Low shrinkage epoxy-cationic curable compositions |
摘要 |
The present invention relates to compositions comprising an epoxy resin; a reagent selected from the group of cationic compounds or compounds which are capable to form cationic compounds or mixtures of those; at least one compound with two aromatic rings and at least one central cyclic oxygen bridged ring and the use of such compositions in adhesives, sealants and coatings.
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申请公布号 |
US7740734(B2) |
申请公布日期 |
2010.06.22 |
申请号 |
US20080275772 |
申请日期 |
2008.11.21 |
申请人 |
HENKEL AG & CO. KGAA |
发明人 |
SUDO ATSUSHI;SUZUKI AKANE;ENDO TAKESHI |
分类号 |
C09J163/00;B05D3/02;B05D3/06;B32B27/38;C08L63/00 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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