| 摘要 |
PURPOSE: A dissipating device of electronic element and memory module employing the dissipating device are provided to support a heat dissipating plate by supporting a heat-sinking member made of the linear structure including the heat sink and radiating unit. CONSTITUTION: The dissipating device of electronic element includes the heat generation element(43) and the circuit board(41). The electronic component radiator includes the heat dissipating plate(45), and the support heat-sinking member(50) of metal. The heat dissipating plate is arranged in the circuit board. The heat dissipating plate releases the heat generated in the heat generation element. The support heat-sinking member supports the heat dissipating plate about the circuit board. The support heat-sinking member releases the heat delivered from the heat dissipating plate. The support heat-sinking member includes the linear structure having the cross section of 'U'. |
