| 摘要 |
PURPOSE: A probe card and a manufacturing method thereof are provided to completely array a pad and a prove care regardless of a pad size by controlling a prove needle pitch according to a pad pitch change. CONSTITUTION: A buffer layer(300) is formed on a wafer(W2). A hole is formed on the wafer into the same form with a pad pattern of the wafer in which a semiconductor chip is formed. A metal layer is formed within the hole. A probe needle(400) is formed by projecting the metal layer through the wafer lower end. A metal wiring pattern(450) touched with an upper end of the wafer and the probe needle is formed.
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