发明名称 |
Integrated circuit package system with stacking module |
摘要 |
An integrated circuit package system comprising: providing a module lead array; attaching a module integrated circuit adjacent the module lead array; attaching a module substrate over the module integrated circuit; and applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.
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申请公布号 |
US7741154(B2) |
申请公布日期 |
2010.06.22 |
申请号 |
US20080055962 |
申请日期 |
2008.03.26 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
HA JONG-WOO;CARSON FLYNN;HONG BUMJOON;LEE SEONGMIN |
分类号 |
H01L21/00;H01L23/495;H05K5/02 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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