| 摘要 |
PURPOSE: A method for improving the thickness repeatability of plasma enchanced-CVD(PECVD) deposited carbon-based films is provided to uniform the thickness of a wafer-to-wafer using a dimethyl-fluoride in order to stabilize acetylene. CONSTITUTION: A pressurized acetylene container, which includes a solvent with around or less than 10 torr of steam pressure at 25°C, is prepared. An acetylene gas stream is delivered from the container to a deposition chamber in order to form a carbon-based film. The carbon-based film is laminated on a semiconductor substrate through the CVD reaction of the acetylene. The carbon-based film is successively laminated on a plurality of semiconductor substrates through the CVD reaction of the acetylene.
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