发明名称 METHOD OF PLATING AND PLATING STRUCTURE
摘要 PURPOSE: A plating method and structure are provided to improve the adhesion of a CuCN layer plated in the surface of a CuCN strike layer by forming a smooth aluminum surface through strike plating. CONSTITUTION: A plating method comprises the steps of: preparing a seed layer(110), plating a metallic coating layer on the seed layer, plating a first chrome layer(160) using chrome chloride liquid on the metallic coating layer, and plating a second chrome layer(170) using chromium sulfate liquid on a chrome chloride layer. The seed layer includes a CuCN layer(140) for plating of the metallic coating layer.
申请公布号 KR20100067385(A) 申请公布日期 2010.06.21
申请号 KR20080125928 申请日期 2008.12.11
申请人 NAM, DONG SIK;PARK, CHUL 发明人 NAM, DONG SIK;PARK, CHUL;PARK, SUNG KYU
分类号 C25D5/14 主分类号 C25D5/14
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