| 摘要 |
PURPOSE: An epoxy resin composition for encapsulating a semiconductor device is provided to enhance the reliability of a semiconductor package by improving an adhesive force with all kinds of lead frames and to secure excellent fire retardant property without using harmful halogen-based flame retardant and a phosphate-based flame retardant. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device includes an epoxy resin, a hardener, a curing accelerator, inorganic filler, and an adhesive strength improver. The adhesive strength improver is a triazole-based compound which is marked as a chemical formula 1 and a tetrazole-based compound which is marked as a chemical formula 2. In the chemical formula 1, R1 is a hydrogen atom, a mercapto group, an amino group, a hydroxyl group, or a hydrocarbon. |
