A STRUCTURE OF A CIRCUIT PATTERN FOR CONTROLLING DEFORMATION OF A SUBSTRATE
摘要
PURPOSE: A wiring pattern structure for a transforming control of a substrate is provided to control of a deformation of the substrate by controlling a wiring width of a wiring pattern. CONSTITUTION: A wiring pattern(30) formed on an insulating layer(20) has a structure where a wiring width changes into the horizontal direction. A sidewall wiring width(Ws) of the wiring pattern is formed smaller than an inner wiring width(Wi). The wiring pattern is formed on the substrate for controlling a deformation control of a substrate. The wiring width of a central part is formed the most in the wiring pattern. The wiring pattern has the symmetrical wiring width based on the central part.
申请公布号
KR20100066673(A)
申请公布日期
2010.06.18
申请号
KR20080125084
申请日期
2008.12.10
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KANG, HO SHIK;KIM, MIN SUNG;YOON, IL SOUNG;KIM, HEUNG KYU;KIM, CHUL KYU;OH, SOO HYUNG