| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to simplify the manufacturing processes of the semiconductor package by changing the structure and the manufacturing method of the semiconductor package. CONSTITUTION: A semiconductor package(600) includes a first substrate(100), a semiconductor chip(200), a second substrate(300) and a fixing unit(400). The semiconductor chip is arranged on the first substrate, and bonding pads(210) are arranged on the upper side(201) of the semiconductor chip. The second substrate includes an insulating substrate, an external connection unit(360) which is arranged on the insulating substrate and a connecting unit(345) which electrically connects the external connection unit and the bonding pads. A fixing unit is filled between the first and the second substrate.</p> |
