| 摘要 |
PURPOSE: A method for manufacturing a semiconductor package is provided to reduce a size of the semiconductor package by forming a circuit pattern including fine pitch and size on the lateral side of the semiconductor package. CONSTITUTION: A through hole(200) of a slit shape which passes through a substrate(10) and an insulating unit which corresponds to gaps between semiconductor chips(30) are formed. Circuit patterns(20) and a metal layer are electrically connected by forming the metal layer on the inside of the substrate and the insulating unit. A mask unit which corresponds to the each circuit pattern is arranged on the metal layer. A side circuit pattern(400) electrically connected to the circuit patterns is formed by patterning the metal layer using the mask unit. |
