| 摘要 |
A semiconductor device includes: a semiconductor chip; a plurality of electrode pads on the semiconductor chip; a wiring board fixed to the semiconductor chip; a plurality of connection pads on the wiring board; a plurality of bonding pads aligned along two sides of the wiring board; and a plurality of leads on the wiring board. The plurality of electrode pads is in a center region of the semiconductor chip. The plurality of second connection pads faces the plurality of electrode pads. The plurality of leads connects the plurality of connection pads to the plurality of bonding pads.
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