| 摘要 |
Provided is an encapsulated medical device including: a plurality of rigid substrates (10a, 10b, 10c, 10d, 10e) which are connected in a string via flexible substrates (11a, 11b, 11c, 11d); and molded bodies (12a, 12b, 12c, 12d). The molded bodies (12a, 12b, 12c, 12d) are molded so as to coat function parts mounted on each of the rigid substrates (10b, 10c, 10d, 10e). The molded bodies (12a, 12b) are arranged between the rigid substrates (10b, 10c) opposing to each other and maintain an interval between the rigid substrates (10b, 10c). The molded body (12c) is arranged between the rigid substrates (10d, 10e) opposing to each other and maintains an interval between the rigid substrates (10d, 10e). |
