| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem, wherein conventional semiconductor devices are not able to arbitrarily adjust the interval of bonding pads to carry out arrangement. <P>SOLUTION: A semiconductor apparatus includes an internal circuit in which a functional block is arranged; and a peripheral circuit in which an I/O buffer cell 205, having a plurality of bonding pads, is arranged along the periphery of the internal circuit. The peripheral circuit has a blank cell 206 arranged along the periphery of the internal circuit so that the adjacent two I/O buffer cells have a predetermined interval. According to such a circuit structure, the semiconductor device which can arbitrarily adjust the interval of bonding pads and carry out arrangement can be provided. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
