| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet which is suppressed in the thermal deterioration owing to the heat history caused with laminating of a semiconductor chip, has a tackiness for insuring the connection reliability, has a low viscosity for completely embedding the unevenness on a substrate or the semiconductor chip, is not sticky at a room temperature to have excellent workability, and to provide a method for manufacturing a semiconductor device using the adhesive sheet. SOLUTION: This adhesive sheet has an adhesive layer obtained by forming an adhesive composition, including (A) a high-molecular weight component, (B) a thermosetting component, (C) a filler, and (D) an antioxidant, into a sheet shape. The adhesive sheet is used to comprise a semiconductor package and made to cure in the air. COPYRIGHT: (C)2010,JPO&INPIT |
