| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating solution supply mechanism by which metal ions can be supplied to a plating tank by dissolving a plating metal at a sufficient speed, and the occurrence of sludge can be prevented. Ž<P>SOLUTION: In the plating solution supply mechanism 1, 12, 13 for supplying a solution containing metal ions, obtained by dissolving a plating metal, to a plating tank 9 for applying a plating treatment to a material W to be plated, a plating solution supply tank 10 is provided. In the plating solution supply tank 10, the plating metal is accommodated in a vessel 20 together with a photocatalyst and immersed in the solution, an oxidant supply mechanism 21 for supplying an oxidant to the periphery of the vessel 20 is provided, an optical window 22 enabling the photocatalyst to be irradiated with light is formed, and a supply means 19 for supplying the solution containing the metal ions to the plating tank 9 is provided. The vessel is configured so that the solution, the metal ions, and oxygen can flow through it, the plating metal and the photocatalyst cannot pass through it, and the light can be transmitted through it. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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