| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for peeling a plated Sn layer, which can easily and surely remove the plated Sn layer from an Sn-plated copper and copper alloy material in a short period of time, and to provide an apparatus for peeling the plated Sn layer. SOLUTION: When peeling the plated Sn layer from a workpiece W having the plated Sn layer formed on the surface of a copper substrate, this peeling method includes immersing the workpieces W into an oxidative solution 13, and anodically electrolyzing the workpieces W while peeling off overlapping parts of the workpieces W from each other and also rubbing them against each other by rotating and stirring the workpieces W to effectively remove the plated Sn layer. COPYRIGHT: (C)2010,JPO&INPIT
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