CERAMIC PACKAGE FOR HOUSING ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive ceramic package for housing an electronic component easily mounted by stably erecting one side surface of a square ceramic base on a wiring substrate for mounting, and to provide a method of manufacturing the same. SOLUTION: The ceramic package 10 for housing an electronic component houses the electronic component 12 by mounting on the ceramic base 11. The ceramic package includes: a cut surface 15, which is arranged on the square one side surface of the ceramic base 11 entirely in a thickness direction and orthogonally to a surface of the ceramic base 11; a dividing groove 16 formed on other three side surfaces except for the one side surface of the ceramic base 11 from the surface of the ceramic base 11 to the middle in the thickness direction; and a fracture surface 17 adjacent to the dividing groove 16. COPYRIGHT: (C)2010,JPO&INPIT