发明名称 WIRELESS COMMUNICATION WITH A MEDICAL IMPLANT
摘要 An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.
申请公布号 US2010149042(A1) 申请公布日期 2010.06.17
申请号 US20080334196 申请日期 2008.12.12
申请人 MICROCHIPS, INC. 发明人 UTSI VINCENT;NORRIS MARK;RICHERD JEAN-DANIEL
分类号 H01Q1/38;A61N1/08 主分类号 H01Q1/38
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