| 摘要 |
PURPOSE: A wafer probing method and a wafer probing station thereof are provided to reduce process time by measuring a probing force generated when a wafer pad is in contact with a wafer probe card probe in order to optimize electrical contact in a wafer probing station. CONSTITUTION: A vacuum chuck(107) loads a wafer. A vertical transferring axial device transfers a vacuum chuck and is contacted with a probe(104) of a probe card. A probing force measuring device measures a probing force generated according to the contact between pads of die included in a wafer and a probe. A control module measures a probing force according to the contact between pads and probes through the probing force measuring device. A control module(114) produces a modified value about the vertical position of the vacuum chuck until the probing force is within a predetermined range. |
