发明名称 LAMP UNIT, CIRCUIT BOARD, AND METHOD OF MANUFATURING CIRCUIT BOARD
摘要 A lamp unit includes a housing with high thermal conductivity, a circuit board fixed to the housing, and including an insulating layer, first copper material layer arranged to be superimposed on one surface side of the insulating layer, and forming a thermal conduction part, and second copper material layer arranged to be superimposed on the other surface side of the insulating layer, a trace part to be connected to an optical semiconductor element being formed in the second copper material layer, and the optical semiconductor element being mounted on the circuit board, and an opening part which is provided in the insulating layer, through which the first copper material layer is exposed toward the other surface side, and in which the optical semiconductor element is arranged with an undersurface thereof bonded to the first copper material layer.
申请公布号 US2010149823(A1) 申请公布日期 2010.06.17
申请号 US20090630014 申请日期 2009.12.03
申请人 发明人 HAPPOYA AKIHIKO
分类号 F21V29/00;B32B38/00;H01B13/00;H05K1/09 主分类号 F21V29/00
代理机构 代理人
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