发明名称 SURFACE MOUNTING LED
摘要 <P>PROBLEM TO BE SOLVED: To secure a sufficient attraction area on the top of a package without enlarging the package and deteriorating light-emitting performance, even in an oblique emission type surface mounting LED having a cut plane for oblique emission on the top of the package. <P>SOLUTION: The surface mounting LED has the package 2 having a mounted electrode 3, a cavity 4 provided in the upper part and opened obliquely upward, and an electrode 5 for an LED, an LED chip 10 carried in the cavity and electrically connected to the electrode for the LED to emit light from the opening part, and a translucent sealing resin part 15 filled in the cavity. A flat plane 2a attractable by an attraction pad is formed on the top of the package, and an inclined surface 2b is provided at a location which is the end of the flat plane and corresponds to the opening part of the cavity. A translucent additional member 20 having an attractable plane continuous with the flat plane is fixed to the inclined surface. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010135547(A) 申请公布日期 2010.06.17
申请号 JP20080309670 申请日期 2008.12.04
申请人 KYORAKU SANGYO KK 发明人 ITO MASAKAZU;HAMADA TAKAHIRO
分类号 H01L33/48 主分类号 H01L33/48
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