发明名称 SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate treatment device that prevents not only the useless treatment of a substrate to be treated by avoiding the treatment itself if the substrate itself to be treated is in distortion and so on, but also the useless treatment in post treatment if the substrate which has been treated does not satisfy predetermined requirements. <P>SOLUTION: The substrate treatment device includes: a holding portion 15 for holding the substrate to be treated 60; a laser irradiation device 20 for irradiating laser light L; a laser moving portion 22 for moving the laser irradiation device 20; and a detection device 50 for detecting an end of the substrate 60 to be treated and a position of the extreme peripheral side of a portion to be treated of a film surface 61. The end of the film surface 61 of the substrate 60 to be treated is removed by moving the irradiating position to the film surface 61 of the laser light L irradiated from the laser irradiation device 20 only if a relation between the position of the end of the substrate 60 to be treated detected by the detection device 50 and that of the utmost peripheral side of the portion to be treated of the film surface 61 is satisfied by the predetermined requirements. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010135550(A) 申请公布日期 2010.06.17
申请号 JP20080309705 申请日期 2008.12.04
申请人 SHIBAURA MECHATRONICS CORP 发明人 OGINO MITSUHIRO
分类号 H01L21/302;H01L31/04 主分类号 H01L21/302
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