摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a PDP with high reliability and with due consideration on its environment aspect, without drooping a mold-sealing member even if joining between a chip pipe and a rear plate is carried out with a side of the chip pipe connected to a discharge device to be at a lower side. Ž<P>SOLUTION: A manufacturing method of the PDP is equipped with a process joining a tubular chip pipe communicating through a through-hole fitted at a rear plate onto the rear plate with the use of mold-sealing member structured of a sealing material to a discharge space with a front plate an a rear plate arranged in opposition and formed by sealing at its periphery. The mold-sealing member 23 is provided with a flat-plate part 23a having a hole part and a cylindrical part 23b, a density of the cylindrical part 23 is structured to be lower than that of the flat plate part 23a, the chip pipe is made in a state with a side connected with a discharge device to be a lower side and pinching the flat plate part of the mold-sealing member with the rear plate on the other side, by heating and melting the mold-sealing member in the state and cooling and solidifying, the chip tube and the rear plate are joined. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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